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| Micro-section
Analysis and Polishing Micro-section analysis involves preparing and mounting samples such as plated through holes, traces and solder joints. Often, failure analysis can be achieved quickly and readily by micro-section analysis. Our Micro-Section reports will provide graphic and photographic evidence of: the initial copper weight, additional plating thickness and final finish thickness as a standard. Additional data includes inner layer line up verification, void identification and evidence of hole contamination. Cleveland Circuits have undertaken micro-section analysis for several years as part of our own internal QA procedures. With the recent investment in our laboratory facility we are now able to offer this service to all our customers on a sub-contract basis. Please call for further details. |
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